Action-Bond 150 is a novel low modulus expansion joint sealant, especially formulated to ensure bubble free cure even at very high temperature and humidity climatic conditions. The product displays excellent thixotropy allowing its use even in very large expansion joints. It cures by reaction with atmospheric humidity to produce a joint sealant with a 50% joint movement accommodation factor and excellent adhesion on substrates traditionally problematic for PU sealants, e.g. glass, aluminum, steel, wood, etc. The extrusion rate and tooling of the sealant remain the same throughout a very wide range of temperature and humidity conditions.

1 box = 12 x grey 600ml foils